计算机控制的SEESR实验系统的研制

SEESR(Simultaneous Electrochemical ESR)是研究电极过程中的自由基中间体行为的理想和方便的手段。在以前研制的ESR仪数据系统的基础上,我们应用IBM-PC/XT微机与JES-FE1XG型(JEOL产)ESR谱仪及HDV-7型恒电位仪研制了一套由计算机控制的SEESR实验装置。该系统可以完成包括循环伏安法、电流阶跃、电位阶跃及电位反转等多种电化学方法的SEESR实验。系统还具有包括数据平滑、曲线拟合等功能的多种数据处理软件,使用方便。我们应用模型化合物对该系统进行了实际测量,所得结果与文献报道一致。     

复合脱氧剂对纯净钢生产的影响

论述复合脱氧剂的一般化学特性，并以碳化硅和硅铝铁两种复合脱氧剂为例，讨论其对改善钢的质量，进行纯净钢生产的影响。     

松香及其衍生物在浮选分离中的应用

介绍了松香的来源、化学组成及理化性质；讨论了松香及其衍生物在非硫化物矿浮选分离、有色金属离子的浮选分离以及从水溶液中浮选分离有机物等方面的应用情况。     

一种新型有机锗化合物的合成及其抗癌性

癌症是当今人类疾病中的第一杀手,寻找新的药物预防和医治癌症是21世纪有机化学的重要研究课题之一。本文报道了一种新型有机锗化合物的合成,它对肺腺癌细胞生长抑制率达88%。     

盛钢桶铝锆碳滑板的研究与生产

通过研究,在盛钢桶用铝锆碳滑板的生产过程中,调整了ZrO2的加入量,添加了复合抗氧化剂,使滑板具用较高的强度和抗氧化性能,提高了滑板的使用寿命.     

高层建筑损伤识别中的补偿算法

本文在已有研究工作的基础上，提出了处理激励测量信息不完备情况下的补偿算法。此方法主要针对高层建筑动力检测中强迫激励的情况，是一种基于时域的识别方法，该方法实际上是利用客观工程实际中结构系统激励所具有的物理持征作为识别计算的辅助条件，来解决测量信息的不完备性问题。算例分析表明了该方法的可行性。     

Microstructure and thermal behavior of Sn-Zn-Ag solders

The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag₅Zn₈ and AgZn₃ become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%     

Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates

The morphologies of intermetallic compounds formed between Sn-Zn based solders and Cu substrates were investigated in this study. The investigated solders were Sn-9Zn, Sn-8.55Zn-0.45Al, and Sn-8.55Zn-0.45Al-0.5Ag. The experimental results indicated that the Sn-9Zn solder formed Cu₅Zn₈ and CuZn₅ compounds on the Cu substrate, while the Al-containing solders formed the Al_4.2Cu_3.2Zn_0.7 compound. The addition of Ag to the Sn-8.55Zn-0.45Al solder resulted in the formation of the AgZn₃ compound at the interface between the Al_4.2Cu_3.2Zn_0.7 compound and the solder. Furthermore, it was found that the cooling rate of the specimen after soldering had an effect on the quantity of AgZn₃ compound formed at the interface. The AgZn₃ compound formed with an air-cooling condition exhibited a rougher surface and larger size than with a water-quenched condition. It was believed that the formation of the AgZn₃ compound at the interface occurs through heterogenous nucleation during solidification.